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[i]The first 300mm technology will be the 0.13 micron generation. This wafer size conversion utilizes a completely new tool set. The 300mm program is being developed by the Logic Technology Development group in Oregon. This group will use the baseline process to develop all future logic technology generations. D1C is Intel's first 300mm factory and will be the home of at least the next two technology development generations.
D1C, in Oregon, is the first 300mm factory at Intel, and the second in the world. Overall, the new 300mm factory is very different from a traditional factory. The tools are all new designs, footprints are larger, and there is extensive automation and mechanization. The overall size of the wafer carriers (FOUP's) drives the transition from hand delivery to mechanized transportation of material. Intel recently announced that it has obtained functional 0.13 micron silicon from its 300mm fab, D1C.[/i]
The new Pentium III's are of .13 micron, code named Tualtin. The Pentium 4 is next to get the small die size.